Bay 1: Etching
Plasma Cleaner
PIE Scientific Tergeo Plasma Cleaner
Automatic tabletop plasma cleaner for research laboratories and low-volume production. Sample cleaning for carbonaceous contamination removal and oxide reduction, surface treatment before biomedical coating, and improving the hydrophilicity of medical implants, optics, glass, and substrate cleaning before epoxy bonding, photoresist ashing, descum, and silicon wafer cleaning.
It is ideal for pre-cleaning hydrocarbon contamination on substrates with a maximum of 4 inches (100 mm) in diameter by utilizing high-purity Argon and Oxygen plasma.
Reactive Ion Etcher
Advanced Vacuum Vision 320 Reactive Ion Etcher
RIE provides etch capability for R&D, prototyping, and low-volume production. This parallel-plate capacitance-based system is found in applications that include fundamental material studies, surface modification, semiconductor device fabrication, and failure analysis involving delayering.
The system is equipped with etching gases such as CF4, CHF3, SF6, Ar, and O2 which are used for etching various materials, including silicon oxide (SiO2), silicon nitride (Si3N4), isotropically etching silicon, and fluorine etchable metals. It is capable of securely holding samples up to the size of a 10-inch substrate.
Other Equipment
There are six wet chemistry fume hoods, a combination of stainless steel and polymer units designed for various chemical processing tasks (cleaning, wet etching, etc.) employed in semiconductor and microelectronic device fabrication.
Hood 6 in Bay Area 1 (Solvent Hood) provides a comprehensive selection of developers and removers for various development processes.
